Ultra-thin electronic device package

Author

Chen, Kevin ; Zenner, Robert ; Arneson, Michael ; Mountain, David

Author_Institution

Fiber Opt. & Electron. Technol Center, 3M Corp., St. Paul, MN, USA

fYear

1999

fDate

1999

Firstpage

657

Lastpage

662

Abstract

We report in this article a feasibility study of ultra-thin device packages that combine thin IC chips, thin flex circuit and adhesive flip chip technology. Using this novel packaging concept, we constructed a 512 Kbyte SRAM memory module that was less than 150 micron thick. Even more profoundly, the package was flexible enough to conform to nonplanar surfaces. This unique property can lead to new applications that would not be feasible otherwise and extend the reach of electronics into brand new areas. Two of these ultra-thin modules were stacked to construct a 3D package with 1 Mbyte of memory capacity that is ~30 times thinner and 30 times lighter than a conventionally packaged device

Keywords

SRAM chips; adhesives; flexible structures; flip-chip devices; integrated circuit packaging; 3D package; 512 Kbyte; SRAM memory module; adhesive flip chip technology; memory capacity; nonplanar surfaces; thin flex circuit; ultra-thin electronic device package; Assembly; Bonding; Chip scale packaging; Consumer electronics; Electronics packaging; Flexible electronics; Flip chip; Integrated circuit packaging; Random access memory; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

0-7803-5231-9

Type

conf

DOI

10.1109/ECTC.1999.776249

Filename

776249