• DocumentCode
    2936125
  • Title

    Quality Chain Service Management of Manufacturing Based on Grid

  • Author

    Dong, Hua ; Xie, Jian ; Yang, Shiyuan

  • Author_Institution
    Key Lab. of Nondestructive Test (Minist. of Educ.), Nanchang Hangkong Univ., Nanchang, China
  • Volume
    4
  • fYear
    2009
  • fDate
    26-27 Dec. 2009
  • Firstpage
    321
  • Lastpage
    324
  • Abstract
    Grid technology enables business management resource sharing, and eliminates the phenomenon of island resources. Quality chain is functional value chain of product or service quality forming process. In the paper, quality chain service management by use of grid technology in manufacturing industry is preliminarily studied, and the architecture of quality chain grid is proposed. Then a quality chain life-cycle service management model based on the quality chain grid is constructed. The role of quality chain grid service management is analyzed with a case, which quality chain takes automobile enterprises as the core enterprises, and materials or parts suppliers, retailer and other relevant partners as member enterprises. It explores service management of manufacturing based on grid technology.
  • Keywords
    grid computing; supply chain management; architecture quality chain grid; business management resource sharing; grid technology; manufacturing based grid; phenomenon island resources; quality chain service management; service quality forming process; value chain product; Collaboration; Computer aided manufacturing; Innovation management; Internet; Manufacturing industries; Quality management; Resource management; Supply chain management; Supply chains; Technology management; Grid technology; manufacturing industry; quality chain; service management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Information Management, Innovation Management and Industrial Engineering, 2009 International Conference on
  • Conference_Location
    Xi´an
  • Print_ISBN
    978-0-7695-3876-1
  • Type

    conf

  • DOI
    10.1109/ICIII.2009.537
  • Filename
    5370518