Title :
A study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow
Author :
Tay, A.A.O. ; Goh, K.Y.
Author_Institution :
Centre for IC Failure Analysis & Reliability, Nat. Univ. of Singapore, Singapore
Abstract :
This paper describes a comprehensive numerical study of the effects of many parameters on the propagation of delaminations in the die-attach layer using a finite element linear elastic fracture mechanics approach. The parameters investigated include the coefficient of thermal expansion (CTE) of the die-attach material, the thickness of the die-attach layer, the CTE of the pad material and the location and size of the initial delaminations (defects). The effect of the pressure of water vapor at the delamination was also investigated
Keywords :
delamination; environmental degradation; finite element analysis; fracture mechanics; humidity; integrated circuit packaging; microassembling; plastic packaging; reflow soldering; thermal expansion; coefficient of thermal expansion; delamination; die attach layer; finite element linear elastic fracture mechanics; hygrothermal loading; plastic IC package; solder reflow; water vapor pressure; Delamination; Failure analysis; Finite element methods; Moisture; Plastic integrated circuit packaging; Plastic packaging; Reflow soldering; Thermal expansion; Thermal factors; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5231-9
DOI :
10.1109/ECTC.1999.776255
