DocumentCode

2936254

Title

Oxide adhesion characteristic of lead frame copper alloys

Author

Tomioka, Yoichi ; Miyake, Jun

Author_Institution

Nippon Mining and Metals Co., Ltd.

fYear

1999

fDate

1-4 June 1999

Firstpage

714

Lastpage

720

Keywords

Adhesives; Conductive films; Copper alloys; Delamination; Electromagnetic compatibility; Lead compounds; Plastic packaging; Reflow soldering; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th

Conference_Location

San Diego, CA, USA

ISSN

0569-5503

Print_ISBN

0-7803-5231-9

Type

conf

DOI

10.1109/ECTC.1999.776258

Filename

776258