Title :
Mechanical modeling of underfills based on two-phase composites
Author :
Haiying Wang ; Qian, Zhengfang ; Liu, Sheng ; Wu, Jiali ; Wong, C.P. ; Okuno, Atsushi
Author_Institution :
Dept. of Mech. Eng., Wayne State Univ., Detroit, MI, USA
Abstract :
In this paper, the effects of filler content on the properties of underfill at different temperatures are studied experimentally and theoretically. The comparison between the experimental results and the analytical prediction shows that the Mori-Tanaka method gives satisfactory predictions at temperatures of investigation. The differential scheme also provides good prediction at elevated temperatures
Keywords :
Young´s modulus; composite materials; encapsulation; flip-chip devices; integrated circuit packaging; IC packaging; Mori-Tanaka method; differential scheme; elevated temperatures; filler content; flip-chip technology; two-phase composites; underfills; Capacitive sensors; Conducting materials; Electronic packaging thermal management; Electronics packaging; Materials science and technology; Mechanical engineering; Mechanical factors; Stress; Temperature; Thermal conductivity;
Conference_Titel :
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5231-9
DOI :
10.1109/ECTC.1999.776274
