Title :
Thermal fatigue analysis of the flip-chip assembly on the Polymer Stud Grid Array (PSGATM) package
Author :
Vandevelde, Bart ; Beyne, Eric ; Van Puymbroeck, Jef ; Heerman, Marcel
Author_Institution :
IMEC, Leuven, Belgium
Abstract :
In this paper, the attention is focused on the thermomechanical modelling of a new type of area array package: the Flip Chip on Polymer Stud Grid Array (PSGATM). The objective of this study is to optimise the material and geometrical design of this PSGA package and the flip chip assembly in order to achieve the highest thermal fatigue reliability for the solder joints in this structure. A parameterised non linear finite element model is used to calculate the inelastic strains induced in the solder joints due to thermal cycling. The techniques of Design Of Experiments (DOE) and Response Surface Modelling (RSM) enhance the parameter sensitivity analysis and optimisation of the PSGA design. After the optimisation of the structure, a very high solder joint fatigue reliability of this flip chip to PSGA package has been achieved
Keywords :
design of experiments; finite element analysis; flip-chip devices; integrated circuit packaging; integrated circuit reliability; plastic packaging; sensitivity analysis; soldering; surface fitting; thermal stress cracking; PSGA; area array package; design of experiments; design optimisation; flip-chip assembly; inelastic strain; nonlinear finite element model; parameter sensitivity analysis; polymer stud grid array; response surface model; solder joint; thermal cycling; thermal fatigue reliability; thermomechanical model; Assembly; Design optimization; Fatigue; Flip chip; Joining materials; Materials reliability; Packaging; Polymers; Soldering; Thermomechanical processes;
Conference_Titel :
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5231-9
DOI :
10.1109/ECTC.1999.776277
