• DocumentCode
    2936651
  • Title

    Thermal fatigue analysis of the flip-chip assembly on the Polymer Stud Grid Array (PSGATM) package

  • Author

    Vandevelde, Bart ; Beyne, Eric ; Van Puymbroeck, Jef ; Heerman, Marcel

  • Author_Institution
    IMEC, Leuven, Belgium
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    823
  • Lastpage
    829
  • Abstract
    In this paper, the attention is focused on the thermomechanical modelling of a new type of area array package: the Flip Chip on Polymer Stud Grid Array (PSGATM). The objective of this study is to optimise the material and geometrical design of this PSGA package and the flip chip assembly in order to achieve the highest thermal fatigue reliability for the solder joints in this structure. A parameterised non linear finite element model is used to calculate the inelastic strains induced in the solder joints due to thermal cycling. The techniques of Design Of Experiments (DOE) and Response Surface Modelling (RSM) enhance the parameter sensitivity analysis and optimisation of the PSGA design. After the optimisation of the structure, a very high solder joint fatigue reliability of this flip chip to PSGA package has been achieved
  • Keywords
    design of experiments; finite element analysis; flip-chip devices; integrated circuit packaging; integrated circuit reliability; plastic packaging; sensitivity analysis; soldering; surface fitting; thermal stress cracking; PSGA; area array package; design of experiments; design optimisation; flip-chip assembly; inelastic strain; nonlinear finite element model; parameter sensitivity analysis; polymer stud grid array; response surface model; solder joint; thermal cycling; thermal fatigue reliability; thermomechanical model; Assembly; Design optimization; Fatigue; Flip chip; Joining materials; Materials reliability; Packaging; Polymers; Soldering; Thermomechanical processes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-5231-9
  • Type

    conf

  • DOI
    10.1109/ECTC.1999.776277
  • Filename
    776277
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2936651