DocumentCode
2936730
Title
Electrical characterization of metal enhanced BGA packages
Author
Solomon, Dawit ; Rosario, Elmer Del ; Opiniano, E. ; Wong, Jackson ; Pinello, W.
Author_Institution
Hana Technol. Inc., San Jose, CA, USA
fYear
1999
fDate
1999
Firstpage
848
Lastpage
852
Abstract
This paper discusses electrical characterization of metal enhanced BGA packages. Three package types with different grounding options are considered in this study. Measurements are performed in the frequency domain to extract key interconnect parasitics and results are compared with full 3D electromagnetic modeling. Basic signal integrity simulation was also performed to predict crosstalk and SSO
Keywords
ball grid arrays; crosstalk; equivalent circuits; integrated circuit interconnections; integrated circuit packaging; modelling; 3D electromagnetic modeling; SSO; crosstalk prediction; electrical characterization; grounding options; interconnect parasitics; metal enhanced BGA packages; signal integrity simulation; Electrical resistance measurement; Electronic components; Electronics packaging; Frequency domain analysis; Grounding; Integrated circuit interconnections; Probes; Scattering parameters; Telephony; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
0-7803-5231-9
Type
conf
DOI
10.1109/ECTC.1999.776281
Filename
776281
Link To Document