Title :
Electrical characterization of metal enhanced BGA packages
Author :
Solomon, Dawit ; Rosario, Elmer Del ; Opiniano, E. ; Wong, Jackson ; Pinello, W.
Author_Institution :
Hana Technol. Inc., San Jose, CA, USA
Abstract :
This paper discusses electrical characterization of metal enhanced BGA packages. Three package types with different grounding options are considered in this study. Measurements are performed in the frequency domain to extract key interconnect parasitics and results are compared with full 3D electromagnetic modeling. Basic signal integrity simulation was also performed to predict crosstalk and SSO
Keywords :
ball grid arrays; crosstalk; equivalent circuits; integrated circuit interconnections; integrated circuit packaging; modelling; 3D electromagnetic modeling; SSO; crosstalk prediction; electrical characterization; grounding options; interconnect parasitics; metal enhanced BGA packages; signal integrity simulation; Electrical resistance measurement; Electronic components; Electronics packaging; Frequency domain analysis; Grounding; Integrated circuit interconnections; Probes; Scattering parameters; Telephony; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5231-9
DOI :
10.1109/ECTC.1999.776281
