The needs, evolution, status and challenges of microelectronics packaging education in the US

Author

Tummala, Rao ; Conrad, Leyla ; May, Gary

Author_Institution

Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA

fYear

1999

fDate

1999

Firstpage

885

Lastpage

892

Abstract

It is only within the last 10 years that packaging has begun to be viewed as an important discipline. Several universities have started to provide packaging courses as well as special focuses on certificate programs. This paper describes human resource needs in terms of quality and quantity of packaging engineers, the evolution of electronic packaging education at all levels in the US to meet these human resource needs, and discusses how the next generation of microelectronics packaging education should be conducted to meet the needs of US industry

Keywords

educational courses; electronic engineering education; human factors; integrated circuit packaging; US universities; USA; certificate programs; human resource needs; microelectronics packaging; packaging courses; packaging education; packaging engineers; Consumer electronics; Educational institutions; Educational programs; Educational technology; Electronics industry; Electronics packaging; Humans; Manufacturing industries; Microelectronics; Semiconductor device packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

0-7803-5231-9

Type

conf

DOI

10.1109/ECTC.1999.776287

Filename

776287