DocumentCode
2937142
Title
Challenges of flip chip on organic substrate assembly technology
Author
Nagesh, V.K. ; Peddada, R. ; Ramalingam, S. ; Sur, B. ; Tai, A.
Author_Institution
Assembly Technol. Dev., Intel Corp., Santa Clara, CA, USA
fYear
1999
fDate
1999
Firstpage
975
Lastpage
978
Abstract
Flip chip assembly on organic substrate technology has been developed and implemented as a key packaging technology for Intel´s microprocessors for cost and performance advantages. In this paper, the process flow, key technology challenges and accomplishments achieved will be addressed. The paper discusses the challenges faced, and their resolution during the development of this key technology that is implemented in high volume manufacturing at Intel
Keywords
flip-chip devices; integrated circuit packaging; microprocessor chips; Intel microprocessor; flip-chip assembly; high volume manufacturing; organic substrate; packaging technology; process flow; Assembly; Costs; Flip chip; Manufacturing processes; Packaging; Silicon; Space technology; Temperature; Testing; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
0-7803-5231-9
Type
conf
DOI
10.1109/ECTC.1999.776304
Filename
776304
Link To Document