MoM validation of the predicted radiated emissions of two signal integrity damping schemes on PCB microstrips

An important consideration in the design of high speed digital systems is the signal integrity of interconnections. Source and destination termination to achieve damping can be effective methods for managing signal integrity. At high signal speeds, emissions from the interconnections play an equally important consideration in terms of electromagnetic compatibility performance of a system. The radiated emissions of interconnections are different for the two damping schemes. Approximate analytical models have been developed for the study of the effects of the two damping methods on emissions and signal integrity. In this paper, a full-wave technique using the method of moments is used to validate the radiated emission predict by the approximate analytical models.