• DocumentCode
    2937371
  • Title

    Models for internet-delivered courses in electronics packaging

  • Author

    Wesling, Paul

  • Author_Institution
    Tandem Div., Compaq Comput. Corp., Cupertino, CA, USA
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    1051
  • Lastpage
    1055
  • Abstract
    Successful instances now exist for delivery of course modules over the internet, as well as through corporate and university intranets. Courses are now available either free or for a fee from several on-line providers within the US$70B corporate training market. A number of commercial courseware providers now have internet-delivered classes. In addition, many universities now provide some classes either to matriculated students or as part of their distance learning program. The structures and techniques in some of these web-based courses are presented, so that instructors can understand how to build similar modular lessons in electronics packaging, based on these practices and results. Sharing of such modules is expected to improve instructional efficiency in the field of electronics packaging, as well as bring best-of-breed lectures and simulations to packaging students, better preparing them for practice in this field. The modules are also of high value to working engineers in this field
  • Keywords
    courseware; distance learning; educational courses; electronic engineering computing; electronic engineering education; information resources; packaging; Internet; World Wide Web; corporate training; courseware; distance learning; educational course; electronics packaging; model; Application software; Authentication; Bandwidth; Computer aided instruction; Courseware; Databases; Educational technology; Electronics packaging; Internet; Java;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-5231-9
  • Type

    conf

  • DOI
    10.1109/ECTC.1999.776317
  • Filename
    776317