Title :
Models for internet-delivered courses in electronics packaging
Author_Institution :
Tandem Div., Compaq Comput. Corp., Cupertino, CA, USA
Abstract :
Successful instances now exist for delivery of course modules over the internet, as well as through corporate and university intranets. Courses are now available either free or for a fee from several on-line providers within the US$70B corporate training market. A number of commercial courseware providers now have internet-delivered classes. In addition, many universities now provide some classes either to matriculated students or as part of their distance learning program. The structures and techniques in some of these web-based courses are presented, so that instructors can understand how to build similar modular lessons in electronics packaging, based on these practices and results. Sharing of such modules is expected to improve instructional efficiency in the field of electronics packaging, as well as bring best-of-breed lectures and simulations to packaging students, better preparing them for practice in this field. The modules are also of high value to working engineers in this field
Keywords :
courseware; distance learning; educational courses; electronic engineering computing; electronic engineering education; information resources; packaging; Internet; World Wide Web; corporate training; courseware; distance learning; educational course; electronics packaging; model; Application software; Authentication; Bandwidth; Computer aided instruction; Courseware; Databases; Educational technology; Electronics packaging; Internet; Java;
Conference_Titel :
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5231-9
DOI :
10.1109/ECTC.1999.776317