DocumentCode
2937371
Title
Models for internet-delivered courses in electronics packaging
Author
Wesling, Paul
Author_Institution
Tandem Div., Compaq Comput. Corp., Cupertino, CA, USA
fYear
1999
fDate
1999
Firstpage
1051
Lastpage
1055
Abstract
Successful instances now exist for delivery of course modules over the internet, as well as through corporate and university intranets. Courses are now available either free or for a fee from several on-line providers within the US$70B corporate training market. A number of commercial courseware providers now have internet-delivered classes. In addition, many universities now provide some classes either to matriculated students or as part of their distance learning program. The structures and techniques in some of these web-based courses are presented, so that instructors can understand how to build similar modular lessons in electronics packaging, based on these practices and results. Sharing of such modules is expected to improve instructional efficiency in the field of electronics packaging, as well as bring best-of-breed lectures and simulations to packaging students, better preparing them for practice in this field. The modules are also of high value to working engineers in this field
Keywords
courseware; distance learning; educational courses; electronic engineering computing; electronic engineering education; information resources; packaging; Internet; World Wide Web; corporate training; courseware; distance learning; educational course; electronics packaging; model; Application software; Authentication; Bandwidth; Computer aided instruction; Courseware; Databases; Educational technology; Electronics packaging; Internet; Java;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
0-7803-5231-9
Type
conf
DOI
10.1109/ECTC.1999.776317
Filename
776317
Link To Document