• DocumentCode
    2937400
  • Title

    Internet based instruction for thermal design of electronic products-making a global impact

  • Author

    Joshi, Yogendra ; Bar-Cohen, Avram ; Bhavnani, Sushil

  • Author_Institution
    CALCE Electron. Products & Syst. Consortium, Maryland Univ., College Park, MD, USA
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    1060
  • Lastpage
    1064
  • Abstract
    Over the past year, a multi-institution team has pioneered the development of a series of internet based instructional modules on thermal design of electronic products. These include web based tutorials on specialized topics, case studies, and a virtual laboratory tour. These efforts are summarized, and the best practices usable in other similar undertakings are identified in this paper. The case study groups so far have been within the United States. As the next step in internet based distance learning, we propose to expand the scope of this effort globally. An expanded team including international thermal design experts will develop case study modules on topics including portable electronics and three-dimensional packaging. Also proposed is a series of internet based video conferences, that brings industry experts into the virtual classroom, on topics of current interest
  • Keywords
    computer aided instruction; distance learning; electronic engineering computing; electronic engineering education; information resources; thermal management (packaging); Internet based instruction; World Wide Web; distance learning; electronic product; portable electronics; thermal design; three-dimensional packaging; video conferencing; virtual laboratory; Educational institutions; Electronic packaging thermal management; Heat engines; Heat transfer; Internet; Laboratories; Liquid cooling; Mechanical engineering; Product design; Thermodynamics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-5231-9
  • Type

    conf

  • DOI
    10.1109/ECTC.1999.776319
  • Filename
    776319