Title :
Failure and yield analysis of fabrication process of 155 Mbps optical transmitter modules
Author :
Hwang, Nam ; Joo, Gwan-Chong ; Lee, Sang-Hwan ; Lee, Hee-Tae ; Kang, Seung-Goo ; Song, Min-Kyu
Author_Institution :
ETRI-Microelectron. Technol. Lab., Taejon, South Korea
Abstract :
The failure and yield on the preliminary result of our pioneer fabrication line of 155 Mbps OTMs adopting a modern Si V-groove and FCB techniques have been studied. The yields of LD purge, sub-module assembly, and final assembly were found to be 78%, 95%, and 77% respectively out of total 319 samples. The yield of whole fabrication process has been found to be 57%, where it can be improved to be 70% or higher by replacing the electrical component assembly process with more advanced IC process
Keywords :
failure analysis; flip-chip devices; optical transmitters; 155 Mbit/s; FCB technique; IC process; LD purge; Si; Si V-groove technique; assembly; fabrication; failure analysis; optical transmitter module; sub-module assembly; yield analysis; Assembly; Bonding; Failure analysis; Optical device fabrication; Optical devices; Optical fibers; Optical microscopy; Optical transmitters; Samarium; Silicon;
Conference_Titel :
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5231-9
DOI :
10.1109/ECTC.1999.776331
