Surface mount type LD module with receptacle structure

We have developed a new surface mount LD module. This module is suitable for mass production while making cost reductions and providing simple and stable handling. The module simplifies the assembly procedure, and it is possible to mount this module directly onto the printed circuit board. The module was produced using hybrid integrated mounting technology including passive alignment technique of optical devices, plastic molded package technique, and a receptacle interface. The module showed a sufficient reliability in application of the trunk line. We describe the structure of the module and key technologies, and propose a method for assuring the reliability of the module with the plastic molded package by sampling tests