• DocumentCode
    2937985
  • Title

    Complementary TFTs and Inverters on Flexible Plastic Substrates Using Si(100) Nanomembranes

  • Author

    Pang, Huiqing ; Yuan, Hao-Chih ; Ma, Zhenqiang ; Celler, G.K.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Wisconsin-Madison, Madison, WI
  • fYear
    2008
  • fDate
    23-25 Jan. 2008
  • Firstpage
    126
  • Lastpage
    129
  • Abstract
    The first complementary thin-film transistor (TFTs) and complementary inverter employing single-crystal Si (100) nanomembranes are demonstrated on a low-temperature flexible plastic substrate. Combined high-temperate and low-temperature processes are employed to enable the integration of both n-and p-channel TFTs (N-TFT and P-TFT) on the same piece of single-crystal Si nanomembrane and to enable the compatibility of the device fabrication with the low-temperature plastic substrate. Under a bias voltage (VDD) of 5 V, the inverters exhibit a gain of 5.88 and switching threshold voltage VM of 2.5 V. The high and low noise margins of the inverter are 2.05 V and 2 V, respectively. These demonstrations may eventually lead to low-power digital switching applications using transferable Si nanomembrane on flexible substrates.
  • Keywords
    invertors; thin film transistors; N-TFT; P-TFT; Si; complementary TFT; complementary inverter; complementary thin-film transistor; device fabrication; low-power digital switching applications; low-temperature flexible plastic substrate; single-crystal nanomembranes; voltage 2 V; voltage 2.05 V; voltage 2.5 V; voltage 5 V; Fabrication; Inverters; Nanoscale devices; Optical materials; Organic materials; Plastics; Radio frequency; Substrates; Temperature; Thin film transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Silicon Monolithic Integrated Circuits in RF Systems, 2008. SiRF 2008. IEEE Topical Meeting on
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    978-1-4244-1855-8
  • Electronic_ISBN
    978-1-4244-1856-5
  • Type

    conf

  • DOI
    10.1109/SMIC.2008.38
  • Filename
    4446272