Implementation of and extensions to Darveaux´s approach to finite-element simulation of BGA solder joint reliability

Author

Johnson, Zane

Author_Institution

Semicond. Products Sector, Motorola Inc., Austin, TX, USA

fYear

1999

fDate

1999

Firstpage

1190

Lastpage

1195

Abstract

Viscoplastic finite-element (FE) simulation is used to predict board-level solder joint reliability of ball grid array (BGA) packages under accelerated temperature cycling (ATC) conditions. The model is first validated against archived ATC data, then parametric studies are conducted to examine the model´s sensitivity to changes in design factors and thermo-mechanical material properties. The use of the program Surface Evolver to predict BGA solder joint shape and profile is briefly discussed

Keywords

ball grid arrays; creep; fatigue; finite element analysis; integrated circuit packaging; integrated circuit reliability; plastic packaging; plasticity; soldering; viscoplasticity; BGA packages; BGA solder joint reliability; Darveaux approach; Surface Evolver program; accelerated temperature cycling; ball grid array packages; board-level solder joint reliability; design factors; finite-element simulation; solder joint profile prediction; solder joint shape prediction; thermo-mechanical material properties; viscoplastic FE simulation; Acceleration; Electronics packaging; Finite element methods; Iron; Material properties; Parametric study; Predictive models; Soldering; Temperature sensors; Thermomechanical processes;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

0-7803-5231-9

Type

conf

DOI

10.1109/ECTC.1999.776357

Filename

776357