• DocumentCode
    2938074
  • Title

    Fabrication and Recording Study of All-Metal Dual-Spin-Valve CPP Read Heads

  • Author

    Childress, J.R. ; Carey, M.J. ; Cyrille, M.C. ; Carey, K. ; Smith, N. ; Katine, J.A. ; Boone, T.D. ; Driskill-Smith, A.G. ; Maat, S. ; Mackay, K. ; Tsang, C.

  • Author_Institution
    Hitachi Global Storage Technol., San Jose
  • fYear
    2006
  • fDate
    8-12 May 2006
  • Firstpage
    277
  • Lastpage
    277
  • Abstract
    All-metallic giant magnetoresistive (GMR) sensors in a current-perpendicular-to-plane (CPP) geometry are attractive candidates for future high-density recording sensors due to their low intrinsic resistance. With increasing recording density the cross-sectional area of CPP sensors (such as TMR or GMR sensors) must also decrease, resulting in a rapid increase in sensor impedance unless the RA product of the sensor stack also decreases. Thus, as recording densities increase above 300 Gb/in2, and sensor sizes decrease below 50nm, low-resistance CPP-GMR sensors become of greater interest to minimize impedance, reduce noise and improve the bandwidth characteristics of the read head. Here we present results on the magnetotransport properties, fabrication, and performance of all-metal CPP-GMR shielded read heads with ultra-narrow physical widths between 40 and 60 nm.
  • Keywords
    giant magnetoresistance; magnetic heads; magnetic sensors; perpendicular magnetic recording; tunnelling magnetoresistance; CPP sensors; GMR sensors; TMR sensors; all-metal dual-spin-valve CPP read heads; all-metallic giant magnetoresistive sensors; current-perpendicular-to-plane geometry; high-density recording sensors; magnetotransport properties; recording density; sensor impedance; Bandwidth; Fabrication; Geometry; Giant magnetoresistance; Impedance; Magnetic heads; Magnetic sensors; Noise reduction; Sensor phenomena and characterization; Tunneling magnetoresistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Magnetics Conference, 2006. INTERMAG 2006. IEEE International
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    1-4244-1479-2
  • Type

    conf

  • DOI
    10.1109/INTMAG.2006.375859
  • Filename
    4261710