DocumentCode :
2938695
Title :
An Empirical Study on the Interaction between Organizational Innovation and Technological Innovation in Manufacturing Companies
Author :
Chun-sheng, Shi ; Chong, XIN
Author_Institution :
Harbin Inst. of Technol.
Volume :
1
fYear :
2006
fDate :
21-23 June 2006
Firstpage :
304
Lastpage :
308
Abstract :
Innovation is necessary for manufacturing enterprises that compete in environments where change is unpredictable, pervasive, and continuous. This paper presents a framework for researching on the relationship between the organizational innovation (OI) and the technological innovation (TI). The study designs a framework that can reflect the harmonious interactive relationship between the two essential factors of the enterprise innovation system. Analyze the harmonious interaction of organizational structure innovation (S-OI) and technological innovation, organizational culture innovation(C-OI) and technological innovation, organizational process innovation (PC-OI) and technological innovation, so as organizational personnel innovation (PN-OI) and technological innovation concretely. And then analyze the relation in the empirical research. Data were obtained from the questionnaire and interviews with managers of the manufacturing enterprises and analysis of statistics and a detailed nominal list of innovation by statistics methods
Keywords :
innovation management; manufacturing industries; organisational aspects; statistical analysis; enterprise innovation system; harmonious interactive relationship; managers; manufacturing companies; organizational culture innovation; organizational personnel innovation; organizational process innovation; organizational structure innovation; statistics methods; technological innovation; Companies; Innovation management; Isolation technology; Manufacturing; Personnel; Production; Recruitment; Statistical analysis; Technological innovation; Technology management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Management of Innovation and Technology, 2006 IEEE International Conference on
Conference_Location :
Singapore, China
Print_ISBN :
1-4244-0147-X
Electronic_ISBN :
1-4244-0148-8
Type :
conf
DOI :
10.1109/ICMIT.2006.262173
Filename :
4035845
Link To Document :
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