DocumentCode
2938695
Title
An Empirical Study on the Interaction between Organizational Innovation and Technological Innovation in Manufacturing Companies
Author
Chun-sheng, Shi ; Chong, XIN
Author_Institution
Harbin Inst. of Technol.
Volume
1
fYear
2006
fDate
21-23 June 2006
Firstpage
304
Lastpage
308
Abstract
Innovation is necessary for manufacturing enterprises that compete in environments where change is unpredictable, pervasive, and continuous. This paper presents a framework for researching on the relationship between the organizational innovation (OI) and the technological innovation (TI). The study designs a framework that can reflect the harmonious interactive relationship between the two essential factors of the enterprise innovation system. Analyze the harmonious interaction of organizational structure innovation (S-OI) and technological innovation, organizational culture innovation(C-OI) and technological innovation, organizational process innovation (PC-OI) and technological innovation, so as organizational personnel innovation (PN-OI) and technological innovation concretely. And then analyze the relation in the empirical research. Data were obtained from the questionnaire and interviews with managers of the manufacturing enterprises and analysis of statistics and a detailed nominal list of innovation by statistics methods
Keywords
innovation management; manufacturing industries; organisational aspects; statistical analysis; enterprise innovation system; harmonious interactive relationship; managers; manufacturing companies; organizational culture innovation; organizational personnel innovation; organizational process innovation; organizational structure innovation; statistics methods; technological innovation; Companies; Innovation management; Isolation technology; Manufacturing; Personnel; Production; Recruitment; Statistical analysis; Technological innovation; Technology management;
fLanguage
English
Publisher
ieee
Conference_Titel
Management of Innovation and Technology, 2006 IEEE International Conference on
Conference_Location
Singapore, China
Print_ISBN
1-4244-0147-X
Electronic_ISBN
1-4244-0148-8
Type
conf
DOI
10.1109/ICMIT.2006.262173
Filename
4035845
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