Title :
Scale effect on packaging materials
Author :
Ren, Wei ; Qian, Zhengfang ; Liu, Sheng
Author_Institution :
Dept. of Mech. Eng., Wayne State Univ., Detroit, MI, USA
Abstract :
The scale effect on the typical packaging materials, underfill HYSOL(R) FP4526, FP4511 and eutectic solder alloy 63Sn37Pb is investigated in this paper. By using specially designed thin strip specimens and a computer controlled 6-axis mini fatigue tester, a series of reliable and consistent test data are obtained. It shows that the specimen scale has no significant effect on the test results within the specimen thickness investigated in this research
Keywords :
Young´s modulus; encapsulation; fatigue testing; lead alloys; packaging; polymers; soldering; tin alloys; 6-axis mini fatigue tester; 63Sn37Pb; FP4511; FP4526; HYSOL; Sn-Pb; eutectic solder alloy; packaging materials; scale effect; specimen scale; test data; underfill encapsulants; Assembly; Computer aided manufacturing; Curing; Electronics packaging; Fatigue; Materials reliability; Soldering; Space technology; Strips; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5231-9
DOI :
10.1109/ECTC.1999.776391
