DocumentCode
2938704
Title
Scale effect on packaging materials
Author
Ren, Wei ; Qian, Zhengfang ; Liu, Sheng
Author_Institution
Dept. of Mech. Eng., Wayne State Univ., Detroit, MI, USA
fYear
1999
fDate
1999
Firstpage
1229
Lastpage
1234
Abstract
The scale effect on the typical packaging materials, underfill HYSOL(R) FP4526, FP4511 and eutectic solder alloy 63Sn37Pb is investigated in this paper. By using specially designed thin strip specimens and a computer controlled 6-axis mini fatigue tester, a series of reliable and consistent test data are obtained. It shows that the specimen scale has no significant effect on the test results within the specimen thickness investigated in this research
Keywords
Young´s modulus; encapsulation; fatigue testing; lead alloys; packaging; polymers; soldering; tin alloys; 6-axis mini fatigue tester; 63Sn37Pb; FP4511; FP4526; HYSOL; Sn-Pb; eutectic solder alloy; packaging materials; scale effect; specimen scale; test data; underfill encapsulants; Assembly; Computer aided manufacturing; Curing; Electronics packaging; Fatigue; Materials reliability; Soldering; Space technology; Strips; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
0-7803-5231-9
Type
conf
DOI
10.1109/ECTC.1999.776391
Filename
776391
Link To Document