A 12-element 60GHz CMOS phased array transmitter on LTCC package with integrated antennas

A 12-element 60GHz phased array transmitter sys-tem-in-package intended for multi-Gbps wireless communications is presented. The system-in-package (SIP) comprises of a CMOS IC and aperture coupled microstrip patch antennas integrated on a low temperature co-fired ceramic (LTCC) package. The IC includes distribution network for 60GHz signals, phase shifters, pre-drivers and PAs. The SIP has been tested using wafer-probing, package-probing and on-the-air measurements including the antennas. The experimental results have been compared extensively against simulations to check the validity of the modeling and experimental methodologies used. The phased-array achieves 21-dB of beam forming gain in line with theoretical expectation. Non-idealities, for example at the RFIC-package interface, have been discussed and modeled due to their importance for mm-wave systems-in-package.