• DocumentCode
    2940932
  • Title

    A New Multiple-Round DOR Routing for 2D Network-on-Chip Meshes

  • Author

    Fu, Binzhang ; Han, Yinhe ; Li, Huawei ; Li, Xiaowei

  • Author_Institution
    Key Lab. of Comput. Syst. & Archit., Chinese Acad. of Sci., Beijing, China
  • fYear
    2009
  • fDate
    16-18 Nov. 2009
  • Firstpage
    276
  • Lastpage
    281
  • Abstract
    The Network-on-Chip (NoC) meshes are limited by the reliability constraint, which impels us to exploit the fault tolerant routing. Particularly, one of the main design issues is minimizing the loss of non-faulty routers at the presence of faults. To address that problem, we propose a new fault tolerant routing, which has the following two distinct advantages: First, it keeps a network deadlock-free by utilizing restricted intermediate nodes rather than adding virtual channels (VC). This characteristic leads to an area-efficient router. Second, in the proposed routing algorithm, the rounds of DOR are not limited by the number of VC´s anymore. As a consequence, the number of sacrificed non-faulty routers is significantly reduced. We demonstrate above advantages through extensive simulations. The experimental results show that under the limitation of VC´s, the proposed routing algorithm always sacrifices the minimal number of non-faulty routers compared to previous solutions.
  • Keywords
    fault tolerant computing; network routing; network-on-chip; reliability; 2D network-on-chip meshes; deadlock-free network; fault-tolerant routing; multiple-round DOR routing; reliability constraint; restricted intermediate nodes; routing algorithm; virtual channels; Computer architecture; Computer networks; Fault tolerance; Laboratories; Network-on-a-chip; Region 4; Routing; Shape; System recovery; Virtual colonoscopy; Fault-tolerant routing; Faulty Region; Network-on-Chip (NoC); Sacrificed Router;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Dependable Computing, 2009. PRDC '09. 15th IEEE Pacific Rim International Symposium on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-0-7695-3849-5
  • Type

    conf

  • DOI
    10.1109/PRDC.2009.50
  • Filename
    5370995