Title :
A comparison of power module transistor stacks
Author :
Van Godbold, C. ; Sankaran, V. Anand ; Hudgins, Jerry L.
Author_Institution :
Dept. of Electr. Eng., South Carolina Univ., Columbia, SC, USA
Abstract :
This work presents an analysis of the effects of substrate and baseplate thermal conductivity on thermal resistance for three power module technologies: direct bond copper (DBC); thick film printed substrate; and insulated metal substrate (IMS). The effects of fatigue induced solder voiding and thermal grease conductivity on thermal resistance are presented for DBC. Accurate modelling of the case-to-sink thermal grease interface is included. The effects of fatigue induced solder voiding are presented for DBC
Keywords :
integrated circuit modelling; power integrated circuits; power transistors; semiconductor device models; soldering; substrates; thermal analysis; thermal conductivity; thermal resistance; baseplate; case-to-sink interface; direct bond copper; fatigue; insulated metal substrate; power module transistor stacks; solder voiding; substrate; thermal conductivity; thermal grease; thermal resistance; thick film printed substrate; Dielectric substrates; Electronic packaging thermal management; Isolation technology; Multichip modules; Semiconductor device packaging; Silicon; Thermal conductivity; Thermal engineering; Thermal resistance; Thick films;
Conference_Titel :
Power Electronics Specialists Conference, 1995. PESC '95 Record., 26th Annual IEEE
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-2730-6
DOI :
10.1109/PESC.1995.474784
