A comparison of power module transistor stacks

Author

Van Godbold, C. ; Sankaran, V. Anand ; Hudgins, Jerry L.

Author_Institution

Dept. of Electr. Eng., South Carolina Univ., Columbia, SC, USA

Volume

1

fYear

1995

fDate

18-22 Jun 1995

Firstpage

3

Abstract

This work presents an analysis of the effects of substrate and baseplate thermal conductivity on thermal resistance for three power module technologies: direct bond copper (DBC); thick film printed substrate; and insulated metal substrate (IMS). The effects of fatigue induced solder voiding and thermal grease conductivity on thermal resistance are presented for DBC. Accurate modelling of the case-to-sink thermal grease interface is included. The effects of fatigue induced solder voiding are presented for DBC

Keywords

integrated circuit modelling; power integrated circuits; power transistors; semiconductor device models; soldering; substrates; thermal analysis; thermal conductivity; thermal resistance; baseplate; case-to-sink interface; direct bond copper; fatigue; insulated metal substrate; power module transistor stacks; solder voiding; substrate; thermal conductivity; thermal grease; thermal resistance; thick film printed substrate; Dielectric substrates; Electronic packaging thermal management; Isolation technology; Multichip modules; Semiconductor device packaging; Silicon; Thermal conductivity; Thermal engineering; Thermal resistance; Thick films;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Electronics Specialists Conference, 1995. PESC '95 Record., 26th Annual IEEE

Conference_Location

Atlanta, GA

Print_ISBN

0-7803-2730-6

Type

conf

DOI

10.1109/PESC.1995.474784

Filename

474784