DocumentCode
2941770
Title
Hybrid mode radiation in patch antenna loaded with corrugated electric via arrays
Author
Cheng, Xiaoyu ; Yoon, Yong-Kyu
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Florida, Gainesville, FL, USA
fYear
2011
fDate
3-8 July 2011
Firstpage
2080
Lastpage
2082
Abstract
A dual band patch antenna is implemented by introducing perfect electric conductor (PEC) boundary conditions using electric via arrays between the patch and the ground in a corrugation pattern. By appropriately designing the via array profile, non-Bragg resonance occurs and a hybrid electromagnetic (EM) mode which is caused by interaction between adjacent transverse EM modes takes place. Higher mode EM radiation is also activated. In this work, two sinusoidal via arrays with a period of 34.6mm, an amplitude of 6mm are fabricated between the patch and the ground, where the dimensions of the patch is 44mm × 32.4mm. The structure is excited with TE10 mode. However, radiation only occurs at a hybrid mode at 6.8GHz and TE20 mode which is 7.3GHz, and thus the proposed structure is working as a mode shifter. Both theoretical derivation, numerical simulation and measurements show good agreement, the proposed structure can be used as a dual band patch antenna as well as EM mode shifter that could excite higher EM modes and suppress fundamental EM modes.
Keywords
antenna radiation patterns; circuit resonance; microstrip antenna arrays; multifrequency antennas; numerical analysis; EM radiation; PEC boundary condition; TE10 mode; adjacent transverse EM mode; array profile; corrugation pattern; dual band patch antenna; hybrid electromagnetic mode; hybrid mode radiation; nonBragg resonance; numerical simulation; perfect electric conductor; Antenna measurements; Boundary conditions; Dual band; Frequency measurement; Patch antennas; Resonant frequency; TE20 mode; hybrid mode; non-Bragg resonance; patch antenna; periodic structure;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation (APSURSI), 2011 IEEE International Symposium on
Conference_Location
Spokane, WA
ISSN
1522-3965
Print_ISBN
978-1-4244-9562-7
Type
conf
DOI
10.1109/APS.2011.5996919
Filename
5996919
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