DocumentCode
2941815
Title
77 GHz MEMS antennas on high-resistivity silicon for linear and circular polarization
Author
Sallam, M.O. ; Soliman, E.A. ; Hassan, S. ; El Katteb, O. ; Sedky, S.
Author_Institution
Phys. Dept., American Univ. in Cairo (AUC), New Cairo, Egypt
fYear
2011
fDate
3-8 July 2011
Firstpage
2083
Lastpage
2086
Abstract
Two new MEMS antennas operating at 77 GHz are presented in this paper. The first antenna is linearly polarized. It possesses a vertical silicon wall that carries a dipole on top of it. The wall is located on top of silicon substrate covered with a ground plane. The other side of the substrate carries a microstrip feeding network in the form of “U-turn” that causes 180° phase shift. This phase-shifter feeds the arms of the dipole antenna via two vertical Through-Silicon Vias (TSVs) that go through the entire wafer. The second antenna is circularly polarized and formed using two linearly polarized antennas spatially rotated with respect to each other by 90° and excited with 90° phase shift. Both antennas are fabricated using novel process flow on a single high-resistivity silicon wafer via bulk micromachining. Only three processing steps are required to fabricate these antennas. The proposed antennas have appealing characteristics, such as high polarization purity, high gain, and high radiation efficiency.
Keywords
dipole antennas; micromachining; micromechanical devices; polarisation; three-dimensional integrated circuits; MEMS antennas; bulk micromachining; circular polarization; dipole antenna; frequency 77 GHz; high gain; high polarization purity; high radiation efficiency; high-resistivity silicon wafer; linear polarization; microstrip feeding network; phase-shifter; through-silicon vias; vertical silicon wall; Dipole antennas; Micromechanical devices; Microstrip; Microstrip antennas; Silicon; Substrates; Bulk Micromachining; Circular Polarization; Dipole Antennas; Linear Polarization; MEMS Antennas;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation (APSURSI), 2011 IEEE International Symposium on
Conference_Location
Spokane, WA
ISSN
1522-3965
Print_ISBN
978-1-4244-9562-7
Type
conf
DOI
10.1109/APS.2011.5996920
Filename
5996920
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