Title :
Thermal Analysis and Design of High-Power LED Street Light
Author :
Yang, Kai ; Chen, Yuqing ; Lin, Bin ; Song, Jidong
Author_Institution :
Coll. of Opt. & Electron. Technol., China JiLiang Univ., Hangzhou, China
Abstract :
LED is called the fourth generation of lighting, which has already been widely used in display and illumination devices. The junction temperature has directly influence upon the life time and reliability of high-power LED, so keeping the junction temperature of LED is a key issue. A method researching radiators based on finite element analysis was introduced. In this paper, the heat performance of LED COB (chip on board) packaging was studied. The radiating model of LED street lamp with a radiator was introduced, and simulated the changing of parameters of radiator by ANSYS.
Keywords :
LED lamps; chip-on-board packaging; finite element analysis; street lighting; thermal analysis; LED COB packaging; LED street lamp; chip-on-board packaging; finite element analysis; heat performance; high-power LED street light; illumination devices; lighting; thermal analysis; Electronic packaging thermal management; Energy consumption; Finite element methods; Heat sinks; Heat transfer; LED lamps; Light emitting diodes; Temperature; Thermal conductivity; Thermal stresses;
Conference_Titel :
Photonics and Optoelectronic (SOPO), 2010 Symposium on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-4963-7
Electronic_ISBN :
978-1-4244-4964-4
DOI :
10.1109/SOPO.2010.5504439
