• DocumentCode
    2942192
  • Title

    Dummy fill Insertion considering the effect on high-frequency characteristics of spiral inductors

  • Author

    Akira Tsuchiya ; Onodera, Hidetoshi

  • Author_Institution
    Department of Communications and Computer Engineering, Kyoto University, Yoshida-honmachi, Sakyo-ku, 606-8501, Japan
  • fYear
    2008
  • fDate
    15-20 June 2008
  • Firstpage
    787
  • Lastpage
    790
  • Abstract
    This paper discusses the effect of dummy fills on spiral inductors. In fabrication processes that use copper wire, metal dummy fills are required to prevent thickness fluctuation in CMP stage. Dummy fills have been thought to affect the wire capacitance, however in high frequency, dummy fills also affect the wire resistance and the wire inductance due to the eddy current in dummy fills. This work evaluates the effect of the dummy fills by 3D field solver and proposes a method to suppress the effect of dummy fills. Experimental results show that the proposed method can decrease the effect of dummy fills on quality factor by 55%.
  • Keywords
    CMOS integrated circuits; Q-factor; copper; high-frequency effects; inductors; 3D field solver; CMP stage; Cu; copper wire; dummy fill insertion; high-frequency characteristics; metal dummy filler; quality factor; spiral inductors; wire capacitance; wire inductance; wire resistance; Capacitance; Copper; Eddy currents; Fabrication; Fluctuations; Frequency; Inductance; Inductors; Spirals; Wire; Spiral inductor; dummy fill; eddy current;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 2008 IEEE MTT-S International
  • Conference_Location
    Atlanta, GA
  • ISSN
    0149-645X
  • Print_ISBN
    978-1-4244-1780-3
  • Electronic_ISBN
    0149-645X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2008.4632950
  • Filename
    4632950