DocumentCode
2942192
Title
Dummy fill Insertion considering the effect on high-frequency characteristics of spiral inductors
Author
Akira Tsuchiya ; Onodera, Hidetoshi
Author_Institution
Department of Communications and Computer Engineering, Kyoto University, Yoshida-honmachi, Sakyo-ku, 606-8501, Japan
fYear
2008
fDate
15-20 June 2008
Firstpage
787
Lastpage
790
Abstract
This paper discusses the effect of dummy fills on spiral inductors. In fabrication processes that use copper wire, metal dummy fills are required to prevent thickness fluctuation in CMP stage. Dummy fills have been thought to affect the wire capacitance, however in high frequency, dummy fills also affect the wire resistance and the wire inductance due to the eddy current in dummy fills. This work evaluates the effect of the dummy fills by 3D field solver and proposes a method to suppress the effect of dummy fills. Experimental results show that the proposed method can decrease the effect of dummy fills on quality factor by 55%.
Keywords
CMOS integrated circuits; Q-factor; copper; high-frequency effects; inductors; 3D field solver; CMP stage; Cu; copper wire; dummy fill insertion; high-frequency characteristics; metal dummy filler; quality factor; spiral inductors; wire capacitance; wire inductance; wire resistance; Capacitance; Copper; Eddy currents; Fabrication; Fluctuations; Frequency; Inductance; Inductors; Spirals; Wire; Spiral inductor; dummy fill; eddy current;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 2008 IEEE MTT-S International
Conference_Location
Atlanta, GA
ISSN
0149-645X
Print_ISBN
978-1-4244-1780-3
Electronic_ISBN
0149-645X
Type
conf
DOI
10.1109/MWSYM.2008.4632950
Filename
4632950
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