Title :
Discontinuous galerkin implementation of domain decomposition time-domain finite-element method
Author :
Ye, Zhenbao ; Wang, Chao-Fu
Author_Institution :
Temasek Labs., Nat. Univ. of Singapore, Singapore, Singapore
Abstract :
A discontinuous Galerkin time-domain finite-element method (DG-TDFEM) is developed for modeling wideband EM response of dielectric loaded waveguide structures. It can be considered as a kind of domain decomposition method (DDM). The hierarchical vector basis functions are used to expand the electric and magnetic fields to maintain high order accuracy and Crank-Nicolson (CN) difference scheme is utilized for the time-partial equation for each subdomain. The fields in adjacent subdomains are directly related to each other by the fields on their interfaces. Thus, there is no need to solve a global matrix equation related to all boundary values. The complex frequency-shifted perfectly matched layers (CFS-PML) are used for the truncation of solution domain. 3-dimensional cavity and waveguide structure with dielectric loading are simulated to demonstrate the accuracy and efficiency of the proposed method.
Keywords :
Galerkin method; boundary-value problems; dielectric waveguides; electric fields; finite element analysis; magnetic fields; time-domain analysis; 3D cavity; Crank-Nicolson difference scheme; DG-TDFEM; boundary value; complex frequency-shifted perfectly matched layer; dielectric loaded waveguide structure; dielectric loading; discontinuous Galerkin time-domain finite-element method; domain decomposition method; electric field; global matrix equation; hierarchical vector basis function; magnetic field; time-partial equation; wideband EM response; Electric fields; Equations; Finite element methods; Mathematical model; Moment methods; Time domain analysis; Transmission line matrix methods; Crank-Nicolson (CN) algorithm; Disontinuous Galerkin method; hierarchical vector basis functions; time-domain finite-element method (TDFEM);
Conference_Titel :
Antennas and Propagation (APSURSI), 2011 IEEE International Symposium on
Conference_Location :
Spokane, WA
Print_ISBN :
978-1-4244-9562-7
DOI :
10.1109/APS.2011.5996988