Title :
Hybrid Temperature Sensor Network for Area-Efficient On-Chip Thermal Map Sensing
Author :
Seungwook Paek ; Wongyu Shin ; Jaeyoung Lee ; Hyo-Eun Kim ; Jun-Seok Park ; Lee-Sup Kim
Author_Institution :
Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
Abstract :
Spatial thermal distribution of a chip is an essential information for dynamic thermal management. To get a rich thermal map, the sensor area is required to be reduced radically. However, squeezing the sensor size is about to face its physical limitation. In this background, we propose an area-efficient thermal sensing technique: hybrid temperature sensor network. The proposed sensor architecture fully exploits the spatial low-pass filtering effect of thermal systems, which implies that most of the thermal information resides in very low spatial frequency region. Our on-chip sensor network consists of a small number of accurate thermal sensors and a large number of tiny relative thermal sensors, responsible for low and high spatial frequency thermal information respectively. By combining these sensor readouts, a thermal map upsampler synthesizes a higher spatial resolution thermal map with a proposed guided upsampling algorithm.
Keywords :
low-pass filters; readout electronics; temperature sensors; thermal management (packaging); area-efficient on-chip thermal map sensing; dynamic thermal management; hybrid temperature sensor network; sensor architecture; sensor readouts; sensor size squeezing; spatial low-pass filtering effect; spatial thermal distribution; thermal map upsampler; thermal sensing technique; Accuracy; Algorithm design and analysis; Clocks; System-on-chip; Temperature sensors; Temperature sensors; area-efficient; collaborative sensing; microprocessors; spatial low-pass filtering effect;
Journal_Title :
Solid-State Circuits, IEEE Journal of
DOI :
10.1109/JSSC.2014.2375335