DocumentCode
2944044
Title
4H-SiC buried gate field controlled thyristor
Author
Singh, R. ; Irvine, K.G. ; Palmour, J.W.
Author_Institution
Cree Res. Inc., Durham, NC, USA
fYear
1997
fDate
23-25 June 1997
Firstpage
34
Lastpage
35
Abstract
Commercial field controlled thyristors (FCT) offer much higher speeds, better dI/dt and dV/dt capabilities, lower on-state voltage drop and more stable high temperature operation than GTOs. They show higher reliability than an MOS based power device. This paper reports the fabrication of the first 4H-SiC FCT using a novel buried gate structure that gives a high DC blocking gain (cathode voltage to gate voltage during off-state). This gate structure was fabricated with a p-type epitaxial layer grown over an n/sup +/ ion implanted gate mesh. While the gate width (L/sub g/) should be as small as possible for a low on-state voltage drop, it should be sufficiently large to prevent debiasing of the gate fingers. Five different gate designs with various channel lengths and implanted gate widths were implemented to analyze the trade-off between on-state voltage drop and blocking voltage.
Keywords
elemental semiconductors; ion implantation; silicon compounds; thyristors; DC blocking gain; SiC; blocking voltage; buried gate field controlled thyristor; cathode voltage; dI/dt capabilities; dV/dt capabilities; gate voltage; high temperature operation; implanted gate widths; ion implanted gate mesh; on-state voltage drop; p-type epitaxial layer; Anodes; Cathodes; Epitaxial growth; Epitaxial layers; Fabrication; Forward contracts; Leakage current; Temperature control; Thyristors; Voltage control;
fLanguage
English
Publisher
ieee
Conference_Titel
Device Research Conference Digest, 1997. 5th
Conference_Location
Fort Collins, CO, USA
Print_ISBN
0-7803-3911-8
Type
conf
DOI
10.1109/DRC.1997.612464
Filename
612464
Link To Document