• DocumentCode
    2944088
  • Title

    1000/spl deg/C operation of diamond Schottky diode

  • Author

    Vescan, A. ; Daumiller, I. ; Gluche, P. ; Ebert, W. ; Kohn, E.

  • Author_Institution
    Dept. of Electron Devices & Circuits, Ulm Univ., Germany
  • fYear
    1997
  • fDate
    23-25 June 1997
  • Firstpage
    40
  • Lastpage
    41
  • Abstract
    Due to the bandgap energy of 5.45 eV, the diamond intrinsic carrier concentration is 10/sup 10/cm/sup -3/ at 1000°C. This is a density found in Si at room temperature and similar device performance may be expected. On the other hand, a number of materials and fabrication difficulties have prevented such a demonstration up to now. The Schottky materials system presented here consisted of a chemically stabilized highly doped (quasi-metallic) Si interfacial layer to diamond, a nitrogen stuffed sputter deposited Si:W alloy and an Au overlap. The (W:Si)N diffusion barrier limited the use of the Au overlay to approximately 800°C. Without this overlayer operation up to 1000°C could be demonstrated. At 1000°C breakdown was observed at 30 V. However, similar devices have shown breakdown voltages up to 150 V at room temperature. A rectification ratio of Ion/Ioff=10 is maintained. To the authors knowledge this is the first demonstration of Schottky barrier operation at very high temperatures.
  • Keywords
    Schottky diodes; carrier density; diamond; electric breakdown; elemental semiconductors; (W:Si)N diffusion barrier; 20 to 1000 C; 30 to 150 V; 5.45 eV; Au; Au overlap; C; Schottky barrier; Schottky materials system; Si; Si:W; WSiN; bandgap energy; breakdown voltages; carrier concentration; diamond Schottky diode; high temperature operation; highly doped Si interfacial layer; rectification ratio; sputter deposited Si:W alloy; Breakdown voltage; Chemicals; Fabrication; Gold alloys; Nitrogen; Photonic band gap; Schottky barriers; Schottky diodes; Silicon alloys; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Device Research Conference Digest, 1997. 5th
  • Conference_Location
    Fort Collins, CO, USA
  • Print_ISBN
    0-7803-3911-8
  • Type

    conf

  • DOI
    10.1109/DRC.1997.612467
  • Filename
    612467