• DocumentCode
    2944377
  • Title

    Economic analysis of 450mm wafer migration

  • Author

    Chien, Chen-Fu ; Wang, J.K. ; Chang, Tzu-Ching ; Wu, Wen-Chin

  • Author_Institution
    Taiwan Semicond. Manuf. Co, Hsinchu
  • fYear
    2007
  • fDate
    15-17 Oct. 2007
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    To achieve the required continuous cost reduction driven by Moore´s Law, both miniaturization through technology advances and wafer size increase have been employed in order to maintain the growth and profitability of semiconductor industry. Although some technical analyses have been done for 450 mm migration, little research has been done on economic analysis to justify the decisions and thus suggest appropriate timing for 450 mm migration. This study aims to fill the gap by proposing a preliminary economic analysis to clarify some myths and facilitate further discussions concerning collaborations among the stakeholders including equipment vendors, customers, and chipmakers.
  • Keywords
    cost reduction; electronics industry; integrated circuit economics; profitability; semiconductor device manufacture; wafer-scale integration; Moore´s Law; continuous cost reduction; economic analysis; miniaturization; profitability; semiconductor industry; size 450 mm; stakeholders; wafer migration; Collaboration; Costs; Electronics industry; Investments; Manufacturing industries; Moore´s Law; Productivity; Research and development; Semiconductor device manufacture; Timing; 450mm; Fab Economics; manufacturing strategy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2007. ISSM 2007. International Symposium on
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1523-553X
  • Print_ISBN
    978-1-4244-1142-9
  • Electronic_ISBN
    1523-553X
  • Type

    conf

  • DOI
    10.1109/ISSM.2007.4446818
  • Filename
    4446818