DocumentCode
2944406
Title
Evolutionary business models and inter-firm engineering processes between the foundry and fabless in the semiconductor industry
Author
Guo, Ruey-Shan ; Su, Yea-Huey ; Chiu, Su-Fen ; Pai, Fan-Yun ; Yeh, Chung-Pin
Author_Institution
Nat. Taiwan Univ., Taipei
fYear
2007
fDate
15-17 Oct. 2007
Firstpage
1
Lastpage
4
Abstract
The goals of this paper are to explore the evolutionary business models between the foundry and fabless and the inter-firm engineering processes. By conducting field interviews and empirical study, this research summarizes three phases of inter-firm business models which include: transaction-based, partnership-based, and collaboration-based relationship. In the third phase, the participating partners include not only the foundry/fabless players but also the third-party suppliers such as EDA vendors, IP providers and design service providers. The transaction targets are exchanged mainly to gain "complementary assets" so that each player can reduce its investment and development risks. To reduce the "transaction costs" within this alliance, these players need seamless collaboration processes and effective inter-firm engineering processes. Service management from the foundry side is also described using a generic framework and some business implications are provided.
Keywords
electronics industry; evolutionary computation; foundries; EDA vendors; IP providers; collaboration-based relationship; design service providers; evolutionary business models; foundry; inter-firm business models; inter-firm engineering process; partnership-based relationship; seamless collaboration process; semiconductor industry; service management; transaction-based relationship; Collaboration; Design engineering; Design for manufacture; Electronics industry; Foundries; Investments; Iron; Manufacturing; Production; Time to market;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 2007. ISSM 2007. International Symposium on
Conference_Location
Santa Clara, CA
ISSN
1523-553X
Print_ISBN
978-1-4244-1142-9
Electronic_ISBN
1523-553X
Type
conf
DOI
10.1109/ISSM.2007.4446820
Filename
4446820
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