DocumentCode
2944599
Title
Development of an automatic CD control system for Cu damascene etching
Author
Nambu, Hidetaka ; Akimoto, Takeshi
Author_Institution
NEC Electron. Corp., Sagamihara
fYear
2007
fDate
15-17 Oct. 2007
Firstpage
1
Lastpage
4
Abstract
A CD control technique for Cu damascene interconnection manufacturing was studied. To achieve target wire capacity and resistance, it is required that the CD of trench is always constant. In this issue, we developed newly CD control technique, and furthermore, the advanced CD control system was released for 90 nm LSI manufacturing, and it was achieved that efficient and accurate CD control on mass production of System LSI.
Keywords
etching; integrated circuit interconnections; integrated circuit manufacture; large scale integration; mass production; process control; LSI manufacturing; automatic CD control system; damascene etching; damascene interconnection manufacturing; mass production; size 90 nm; target wire capacity; Automatic control; Control systems; Etching;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 2007. ISSM 2007. International Symposium on
Conference_Location
Santa Clara, CA
ISSN
1523-553X
Print_ISBN
978-1-4244-1142-9
Electronic_ISBN
1523-553X
Type
conf
DOI
10.1109/ISSM.2007.4446832
Filename
4446832
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