• DocumentCode
    2944763
  • Title

    Process and chamber health monitoring of plasma enhanced ti deposition process through high performance VI-probe

  • Author

    Baek, Kye Hyun ; Coonan, Barry ; Carbery, Marcus ; Joo, Jinkyung ; Woo, Hyunsoo ; Lee, Tae Soon ; An, Hyeon Soo ; Koo, Yoonbon ; Han, Cheonsu ; Han, Sungho ; Kim, Yongjin ; Choi, Seong Woon ; Han, Woosung

  • Author_Institution
    Samsung Electron. Co. Ltd., Hwasung
  • fYear
    2007
  • fDate
    15-17 Oct. 2007
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    As an alternative to plasma sensors, high performance VI probe was evaluated in a plasma enhanced Ti deposition process. Its utilization was focused on finding any reasonable differences between good and bad chambers classified in terms of end of line yield data. Some differences of delivered power and time trace current signal between chambers were found, which well matches the good and bad chamber classification. Also, a fault detection and classification algorithm to handle huge amount of raw VI-probe data was evaluated. The algorithm estimates deviation of TiCl4 content in plasma occurs right after preventive maintenance, which might be considered as a chamber conditioning procedure. Despite requiring additional evaluations, the combination of VI-probe and well-developed algorithm might be a feasible solution where conventional plasma sensors can not be applied.
  • Keywords
    fault location; plasma deposition; plasma probes; ISSM paper; PC-P-059; VI probe; fault detection; health monitoring; plasma enhanced deposition; plasma sensors; Inductors; Monitoring; Plasma applications; Plasma devices; Plasma materials processing; Plasma measurements; Plasma properties; Probes; Sensor phenomena and characterization; Signal processing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2007. ISSM 2007. International Symposium on
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1523-553X
  • Print_ISBN
    978-1-4244-1142-9
  • Electronic_ISBN
    1523-553X
  • Type

    conf

  • DOI
    10.1109/ISSM.2007.4446841
  • Filename
    4446841