Title :
Particle reduction using Y2O3 material in an etching tool
Author :
Miwa, Kazuhiro ; Sawai, Takafumi ; Aoyama, Masaaki ; Inoue, Fumihiko ; Oikawa, Akira ; Imaoka, Kazunori
Author_Institution :
Spansion Inc., Fukushima
Abstract :
Particles between metal lines were detected on etched wafers in a process tool with an Al2O3 window on top of the chamber. The particle was speculated to be derived from fluorinated Al2O3 surface in the chamber. In this paper, an attempt was described to reduce that kind of particles by using Y2O3 material within the chamber.
Keywords :
etching; ISSM paper; Y2O3 material; etched wafers; etching tool; metal lines; particle reduction; Aluminum oxide; Etching; Plasma applications; Plasma density; Plasma devices; Plasma materials processing; Radio frequency; Rough surfaces; Scanning electron microscopy; Surface roughness;
Conference_Titel :
Semiconductor Manufacturing, 2007. ISSM 2007. International Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
978-1-4244-1142-9
Electronic_ISBN :
1523-553X
DOI :
10.1109/ISSM.2007.4446866
