Burn-in operations improvement with full automation and OEE/OEU

Author

Angeles, Elsa ; Rajput, Krishna ; Cruz, M. ; Almonte, A. ; Libiran, I. ; Minor, K. ; Realdy, A. ; Li, M. ; Karr, R. ; Buchanan, M. ; Ajouri, S.

Author_Institution

Texas Instrum. (Philippines) Inc., Baguio

fYear

2007

fDate

15-17 Oct. 2007

Firstpage

1

Lastpage

4

Abstract

The ultimate goal in every semiconductor assembly/test manufacturing process is to attain the highest quality standard and process yield. With traditional Process Controls relying on manual inspections and human-dependent process control, the quality and yield goals are very difficult to achieve. With out full knowledge of what is happening in the burn-in process and without data to analyze burn-in operational efficiency, the operational metrics seem impossible to improve. This paper aims to document the works and lessons learned in developing and deploying Burn-in Full Automation and OEE/OEU and impact to Burn-in quality, yield and productivity in Texas Instruments (Philippines) Inc.

Keywords

assembling; electronic equipment manufacture; electronic equipment testing; process control; burn-in full automation; burn-in operational efficiency; burn-in operations improvement; overall equipment effectiveness; process controls; semiconductor assembly; test manufacturing process; Automation; Bismuth; Certification; Data analysis; Instruments; Process control; Production; Stress; Temperature; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing, 2007. ISSM 2007. International Symposium on

Conference_Location

Santa Clara, CA

ISSN

1523-553X

Print_ISBN

978-1-4244-1142-9

Electronic_ISBN

1523-553X

Type

conf

DOI

10.1109/ISSM.2007.4446878

Filename

4446878