Title :
Forward echelon-based inventory monitoring in semiconductor supply chain
Author :
Guo, Ruey-Shan ; Chiang, David ; Lin, Hong-Wen ; Guo, Mei-Shang
Author_Institution :
Nat. Taiwan Univ., Taipei
Abstract :
As the semiconductor industry faces more and more fierce competition, it is essential for semiconductor supply chain to integrate front-end and back-end to provide better service to customers. In order to enhance the service levels and improve the performance of the whole supply chain, the front-end member (fab) is more effective in coordinating all members to share their information and synchronize their operations. As a result, the goal of this research is to develop a forward echelon-based inventory monitoring scheme based on the concept of echelon WIP inventory and CONWIP system. The first step in the proposed scheme is to construct a forward echelon-based model with the goal of minimizing the echelon WIP inventory control limits under target service levels. Next, this two-echelon model is solved by a proposed algorithm. The proposed scheme has been validated through simulation study. Based on the simulation validation results, conclusions are drawn as follows: 1) The proposed algorithm can derive the forward echelon-based WIP inventory limits effectively; 2) Compared to the traditional stage-based inventory monitoring scheme, the proposed forward echelon-based inventory monitoring scheme can obtain a higher service level with lower inventory levels.
Keywords :
semiconductor device manufacture; stock control; supply chain management; CONWIP system; echelon WIP inventory control; forward echelon-based inventory monitoring; front-end member; semiconductor industry; semiconductor supply chain; stage-based inventory monitoring scheme; two-echelon model; Electronics industry; Industrial engineering; Inventory control; Lead compounds; Monitoring; Production systems; Pulp manufacturing; Routing; Semiconductor device manufacture; Supply chains;
Conference_Titel :
Semiconductor Manufacturing, 2007. ISSM 2007. International Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
978-1-4244-1142-9
Electronic_ISBN :
1523-553X
DOI :
10.1109/ISSM.2007.4446882