• DocumentCode
    2945534
  • Title

    Vacuum chamber fast dehumidification ∼Water control in semiconductor manufacturing equipment∼

  • Author

    Yamawaku, Jun ; Moriya, Tsuyoshi ; Ryu, Yoshitaka ; Abe, Kazumasa ; Yakushiji, Hideki ; Hosaka, Yuki ; Kato, Chie

  • Author_Institution
    Tokyo Electron AT Ltd., Nirasaki
  • fYear
    2007
  • fDate
    15-17 Oct. 2007
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Water residues become a serious problem in semiconductor manufacturing systems. In this paper, one of the methods to dehumidify in process chamber is proposed and demonstrated. With this technique, conventional evacuation time can be improved by 2times to 3times. We also demonstrated influence of water adsorbed on wafer.
  • Keywords
    absorption; semiconductor device manufacture; water; process chamber; semiconductor manufacturing equipment; semiconductor manufacturing systems; vacuum chamber fast dehumidification; wafer water adsorption; water control; water residue; Semiconductor device manufacture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2007. ISSM 2007. International Symposium on
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1523-553X
  • Print_ISBN
    978-1-4244-1142-9
  • Electronic_ISBN
    1523-553X
  • Type

    conf

  • DOI
    10.1109/ISSM.2007.4446884
  • Filename
    4446884
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2945534