Title :
Fine edge and bevel film stripping process by novel wet cleaning tool beyond 45nm node
Author :
Ogawa, Yoshihiro ; Nagashima, Hidenobu ; Yoshimizu, Yasuhito ; Tomita, Hiroshi ; Kishimoto, Takuya ; Miya, Katsuhiko ; Izumi, Akira
Author_Institution :
Toshiba Corp., Yokohama
Abstract :
In this paper, we indicate the difficulty of high-k film stripping of edge cut area using conventional bevel and backside etching tool and propose a fine edge cut control process using a novel bevel and backside etching tool with edge dispense nozzles.
Keywords :
cutting; etching; machine tools; nozzles; strips; surface cleaning; backside etching tool; bevel film stripping; edge dispense nozzle; fine edge cut control process; fine edge film stripping; wet cleaning tool; Aluminum oxide; Chemicals; Cleaning; Hafnium; High K dielectric materials; High-K gate dielectrics; Process control; Semiconductor films; Silicon compounds; Wet etching;
Conference_Titel :
Semiconductor Manufacturing, 2007. ISSM 2007. International Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
978-1-4244-1142-9
Electronic_ISBN :
1523-553X
DOI :
10.1109/ISSM.2007.4446885
