DocumentCode
2946025
Title
Laser removal of particles using tunable wavelength
Author
Curran, C. ; Lee, Jang M. ; Watkins, K.G.
Author_Institution
Dept. of Eng., Liverpool Univ., UK
fYear
2000
fDate
10-15 Sept. 2000
Abstract
Summary form only. As semiconductor and microelectronic devices are becoming increasingly smaller, contamination of these devices is becoming an increasing problem for manufacturers. Conventional techniques such as mechanical wiping, scrubbing and etching may involve chemicals and hence pose possible environmental problems as well as introducing possible changes in surface profile. Therefore steps have been taken to introduce new techniques that do not pose any of these problems, one such technique is to use lasers. Laser cleaning is versatile, controllable, selective and environmentally friendly.
Keywords
laser materials processing; semiconductors; surface cleaning; laser cleaning; particle removal; pulsed laser radiation; semiconductors; tunable wavelength; Chemical lasers; Environmental factors; Etching; Green cleaning; Microelectronics; Optical control; Semiconductor device manufacture; Semiconductor lasers; Surface contamination; Tunable circuits and devices;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Europe, 2000. Conference Digest. 2000 Conference on
Conference_Location
Nice
Print_ISBN
0-7803-6319-1
Type
conf
DOI
10.1109/CLEOE.2000.909712
Filename
909712
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