Title :
Simultaneous switching noise simulation for thin film packages using macromodeling technique
Author :
Huang, Chender ; Celik, Mustafa ; Prince, John L.
Author_Institution :
Arizona Univ., Tucson, AZ, USA
Abstract :
This paper presents a fast and accurate methodology for Simultaneous Switching Noise (SSN) simulation for thin film packaging structures using a macro-modeling technique. The combination of interconnect macromodels and SPICE simulation for nonlinear drivers make this technique attractive for large SSN simulation. This technique results in one order of magnitude improvement in the simulation speed for SSN when compared with conventional SPICE run time
Keywords :
SPICE; equivalent circuits; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; thin film circuits; SPICE simulation; interconnect macromodels; macromodeling technique; simultaneous switching noise simulation; thin film packages; Admittance; Circuit simulation; Costs; Driver circuits; Electronics packaging; Integrated circuit interconnections; SPICE; Semiconductor device noise; Switching circuits; Transistors;
Conference_Titel :
Electronic Components and Technology Conference, 1996. Proceedings., 46th
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3286-5
DOI :
10.1109/ECTC.1996.550490
