DocumentCode
2947505
Title
Highly integrated ultra compact RF transceiver module for wireless data and telephone applications
Author
Guruprasad, M. ; Chow, David
Author_Institution
Philip Sound & Vision, Singapore
fYear
1997
fDate
2-4 Dec 1997
Firstpage
238
Lastpage
241
Abstract
This paper describes an ultra compact DECT RF module using highly integrated concept developed by Philips. The module architecture, performance and specific advantages are presented. This state of the art module meets the most stringent requirements of DECT wireless applications
Keywords
BiCMOS integrated circuits; MESFET integrated circuits; cordless telephone systems; data communication; modules; transceivers; BiCMOS; DECT RF module; DECT standard; MESFET IC; Philips; integrated RF transceiver module; module architecture; performance; power amplifier; telephone applications; wireless data applications; Costs; Frequency modulation; Frequency shift keying; Radio frequency; Radio transmitters; Telecommunication standards; Telephone sets; Telephony; Time division multiple access; Transceivers;
fLanguage
English
Publisher
ieee
Conference_Titel
Consumer Electronics, 1997. ISCE '97., Proceedings of 1997 IEEE International Symposium on
Print_ISBN
0-7803-4371-9
Type
conf
DOI
10.1109/ISCE.1997.658396
Filename
658396
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