DocumentCode :
2947882
Title :
Injection Process Analysis and Mold Manufacturing for Telephone Cover
Author :
Kuang, Weihua ; Xue, Zikai
Author_Institution :
Fac. of Mater. & Energy, Guangdong Univ. of Technol., Guangzhou, China
Volume :
2
fYear :
2009
fDate :
11-12 April 2009
Firstpage :
80
Lastpage :
83
Abstract :
In injection process, many factors affect the molding process and the final quality of the parts. The method of traditional mold design is relied on the designerpsilas experience, and it can be time-consuming and expensive. With the help of CAE systems, designers can reduce costly trial-and-error loops and shorten development cycle, and correctly solve production problems on material property, product design, and mold design. The paper introduced the application of MoldFlow in injection molding development of the telephone cover. Best injection location is attained. Fill time, weld lines, air trips, clamp force, pressure at end of fill, and pressure at injection location are deeply studied. The numerical simulation corresponds well with practical process. The simulation provides scientific and valuable injection process information and helps engineers to take right decisions when they develop the tools. At last, the mold for telephone is designed, and the CNC machining of the mold cavity is programmed by UG NX software.
Keywords :
computer aided engineering; computerised numerical control; injection moulding; machining; numerical analysis; product design; production engineering computing; CAE systems; CNC machining; UG NX software; injection molding development; injection process analysis; mold design; mold manufacturing; numerical simulation; product design; telephone cover; trial-and-error loops; Clamps; Computer aided engineering; Injection molding; Manufacturing processes; Material properties; Numerical simulation; Product design; Production systems; Telephony; Welding; CNC machining; injection process; mold design;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Measuring Technology and Mechatronics Automation, 2009. ICMTMA '09. International Conference on
Conference_Location :
Zhangjiajie, Hunan
Print_ISBN :
978-0-7695-3583-8
Type :
conf
DOI :
10.1109/ICMTMA.2009.35
Filename :
5203382
Link To Document :
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