DocumentCode :
2948078
Title :
Magnetization reversal in electrodeposited CoNi/Cu multilayer nanowires
Author :
Tang, X. ; Wang, G. ; Shima, M.
Author_Institution :
Rensselaer Polytech. Inst., Troy
fYear :
2006
fDate :
8-12 May 2006
Firstpage :
824
Lastpage :
824
Abstract :
Magnetization reversal and superparamagnetic behavior in electrodeposited CoNi/Cu multilayer nanowires with the CoNi layer thicknesses t(CoNi) ranging from nanometer to micrometer scales were investigated using vibrating sample magnetometer (VSM) and superconducting quantum interference device (SQUID). The angular dependence of the magnetization measurements with respect to the wire axis shows that CoNi/Cu nanowires exhibit different magnetization reversal processes depending on t(CoNi). The reversal for nanowires with thin disk-shaped CoNi layers (nanometer thickness) is of coherent rotation type, while that for long rod shaped CoNi layers (micrometer thickness) is consistent with a combination of coherent rotation and curling modes. The coercivity of the nanowires measured at room temperature decreases when t(CoNi) decreases (< 7 nm) and becomes nearly zero when t(CoNi) further decreases (< 2 nm), indicating a superparamagnetic behavior in the thin CoNi layers.
Keywords :
cobalt alloys; coercive force; copper; electrodeposition; magnetic multilayers; magnetisation reversal; nanowires; nickel alloys; superparamagnetism; CoNi-Cu; SQUID; angular dependence; coercivity; coherent rotation; curling modes; electrodeposited multilayer nanowires; magnetization reversal; superconducting quantum interference device; superparamagnetic behavior; temperature 293 K to 298 K; thin disk-shaped layers; vibrating sample magnetometer; Interference; Magnetic multilayers; Magnetization reversal; Nanoscale devices; Nanowires; SQUID magnetometers; Superconducting devices; Superconducting epitaxial layers; Superconducting filaments and wires; Temperature measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Magnetics Conference, 2006. INTERMAG 2006. IEEE International
Conference_Location :
San Diego, CA
Print_ISBN :
1-4244-1479-2
Type :
conf
DOI :
10.1109/INTMAG.2006.374855
Filename :
4262257
Link To Document :
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