• DocumentCode
    2948574
  • Title

    Large exchange coupling and high thermal stability in synthetic antiferromagnet with ultrathin seed layer

  • Author

    Fukumoto, Y. ; Honjo, H. ; Igarashi, C. ; Nagase, T. ; Ishiwata, N. ; Ikegawa, S. ; Yoda, H. ; Tahara, S.

  • Author_Institution
    NEC Corp., Sagamihara
  • fYear
    2006
  • fDate
    8-12 May 2006
  • Firstpage
    857
  • Lastpage
    857
  • Abstract
    A synthetic antiferromagnet (SAF) consisting of two ferromagnetic layers antiferromagnetically coupled is a key component for a magnetoresistive element. By using an SAF as a free layer of conventional MRAMs, the switching characteristics and scalability can be improved. Toggle MRAMs must use SAF free layers. When the SAFs that use a spacer layer of Ru are grown on the AlO-barrier layer of magnetic tunnel junctions (MTJs), the antiferromagnetic coupling (AFC) significantly deteriorates. Until now, a thin Ru layer( < 1 nm) has been mostly used for the SAFs to obtain a strong AFC, which is, however, significantly deteriorated by high-temperature( > 300degC) annealing. This is a serious problem for the MgO-barrier MTJs that need high-temperature annealing. To solve these issues, we developed SAFs with an ultrathin seed layer and we used them in toggle MRAMs.
  • Keywords
    antiferromagnetic materials; exchange interactions (electron); magnetic storage; magnetic tunnelling; magnetoresistive devices; random-access storage; thermal stability; MRAM; antiferromagnetic coupling; exchange coupling; ferromagnetic layers; high-temperature annealing; magnetic tunnel junction; magnetoresistive element; scalability; switching characteristics; synthetic antiferromagnet; thermal stability; ultrathin seed layer; Annealing; Antiferromagnetic materials; Automatic frequency control; Couplings; Laboratories; Magnetic tunneling; National electric code; Saturation magnetization; Thermal stability; Writing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Magnetics Conference, 2006. INTERMAG 2006. IEEE International
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    1-4244-1479-2
  • Type

    conf

  • DOI
    10.1109/INTMAG.2006.374888
  • Filename
    4262290