A method to determine the frequency performance and noise margin of various interconnect technologies

Author

Kar, Jayashree ; Shukla, Rama ; Bhattacharyya, Bidyut

Author_Institution

Intel Corp., Chandler, AZ, USA

fYear

1996

fDate

28-31 May 1996

Firstpage

798

Lastpage

802

Abstract

In this paper we have shown a method to evaluate various interconnect technologies by circuit simulations. Two different BGA packages with organic and ceramic substrate, mounted on conventional FR4 board are under consideration. We also have taken a configuration by using MCM interconnect where all the chips are mounted by C4 technology directly on copper polymide on ceramic substrate that has small design features, 25 micron line width and 50 micron space. We have considered the performance of the two different substrates, organic and ceramic substrates with BGA packages compared to MCM interconnect in both T and BUS design

Keywords

circuit analysis computing; integrated circuit interconnections; integrated circuit noise; integrated circuit packaging; multichip modules; permittivity; 25 micron; 50 micron; BGA packages; C4 technology; FR4 board; ceramic substrates; circuit simulations; design features; frequency performance; interconnect technologies; line width; noise margin; organic substrates; Ceramics; Circuit noise; Clocks; Copper; Frequency; Integrated circuit interconnections; Packaging; Routing; Space technology; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1996. Proceedings., 46th

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-3286-5

Type

conf

DOI

10.1109/ECTC.1996.550499

Filename

550499