Title :
A method to determine the frequency performance and noise margin of various interconnect technologies
Author :
Kar, Jayashree ; Shukla, Rama ; Bhattacharyya, Bidyut
Author_Institution :
Intel Corp., Chandler, AZ, USA
Abstract :
In this paper we have shown a method to evaluate various interconnect technologies by circuit simulations. Two different BGA packages with organic and ceramic substrate, mounted on conventional FR4 board are under consideration. We also have taken a configuration by using MCM interconnect where all the chips are mounted by C4 technology directly on copper polymide on ceramic substrate that has small design features, 25 micron line width and 50 micron space. We have considered the performance of the two different substrates, organic and ceramic substrates with BGA packages compared to MCM interconnect in both T and BUS design
Keywords :
circuit analysis computing; integrated circuit interconnections; integrated circuit noise; integrated circuit packaging; multichip modules; permittivity; 25 micron; 50 micron; BGA packages; C4 technology; FR4 board; ceramic substrates; circuit simulations; design features; frequency performance; interconnect technologies; line width; noise margin; organic substrates; Ceramics; Circuit noise; Clocks; Copper; Frequency; Integrated circuit interconnections; Packaging; Routing; Space technology; Voltage;
Conference_Titel :
Electronic Components and Technology Conference, 1996. Proceedings., 46th
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3286-5
DOI :
10.1109/ECTC.1996.550499
