DocumentCode
2948848
Title
CPP-GMR Films with Tilted Incident Deposition
Author
Hoshiya, H. ; Hoshino, K.
Author_Institution
Hitachi Ltd, Kanagawa
fYear
2006
fDate
8-12 May 2006
Firstpage
873
Lastpage
873
Abstract
The paper discuss about the CPP-GMR films deposited with tilted incidence. The tilted free layer slightly increased MR ratio and RA, but the MR ratio was decreased when included a tilted Cu spacer. These results suggest that using tilted deposition can increase scattering at a layer having tilted grain boundaries.
Keywords
cobalt alloys; copper; giant magnetoresistance; grain boundaries; iron alloys; lead; magnetic multilayers; manganese alloys; platinum alloys; ruthenium; sputtered coatings; CPP-GMR films; DC magnetron sputtering system; Pb-MnPt-CoFe-Ru-CoFe-Cu-CoFe - Interface; current-perpendicular-to-the-plane giant magnetoresistive films; grain boundaries; tilted incident deposition; Electrical resistance measurement; Electrons; Giant magnetoresistance; Grain boundaries; Hard disks; Laboratories; Magnetic films; Magnetic heads; Scattering; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Magnetics Conference, 2006. INTERMAG 2006. IEEE International
Conference_Location
San Diego, CA
Print_ISBN
1-4244-1479-2
Type
conf
DOI
10.1109/INTMAG.2006.374904
Filename
4262306
Link To Document