Flexible packaging for tyre integrated shear force sensor

Author

Kulinyi, S. ; Vegvari, R. ; Pongracz, Anita ; Nagy, Akos ; Karpati, Tamas ; Adam, Maricel ; Battistig, Gabor ; Barsony, Istvany

Author_Institution

WESZTA-T Ind. & Commercial Ltd., Budakalász, Hungary

fYear

2012

fDate

28-31 Oct. 2012

Firstpage

1

Lastpage

4

Abstract

Wireless Si 3D force sensor made by MEMS technology was integrated and tested on the sidewall of a tyre using flexible rubber repair patch (patent pending) in order to monitor the deformation of the rotating tyre in automotive applications. Finite element simulation was used to determine the optimal positioning of the sensor structure. Power supply and wireless communication is based on inductive coupling. Static characterization on a measurement pad and preliminary real life-testing has been carried out.

Keywords

automobile industry; condition monitoring; deformation; elemental semiconductors; finite element analysis; force sensors; maintenance engineering; microsensors; silicon; tyres; wireless sensor networks; MEMS technology; Power supply; Si; finite element simulation; flexible packaging; flexible rubber repair patch; inductive coupling; integrated shear force sensor; measurement pad; preliminary real life-testing; tyre; wireless 3D force sensor; wireless communication; Force sensors; Piezoresistance; Roads; Sensor systems; Silicon; Tires; Wheels;

fLanguage

English

Publisher

ieee

Conference_Titel

Sensors, 2012 IEEE

Conference_Location

Taipei

ISSN

1930-0395

Print_ISBN

978-1-4577-1766-6

Electronic_ISBN

1930-0395

Type

conf

DOI

10.1109/ICSENS.2012.6411326

Filename

6411326