Title :
A high density, high performance MCM-D/C package: a design, electrical, and process perspective
Author :
Ellsworth, M.J., Jr. ; Hamel, H. ; Perfecto, E.D. ; Wassick, T.
Author_Institution :
IBM Microelectron. Div., Hopewell Junction, NY, USA
Abstract :
This paper describes a state-of-the-art seven chip MCM-D/C package currently under production for use as a processor module for the high end of IBM´s AS/400 Advanced Series with PowerPC technology. Physical design, process, and electrical design (characterization) is described, and trade-offs made between them are discussed
Keywords :
integrated circuit packaging; integrated circuit yield; microprocessor chips; multichip modules; IBM AS/400 Advanced Series; MCM-D/C package; PowerPC technology; electrical design; physical design; processor module; Application specific integrated circuits; Capacitors; Electronics packaging; Microelectronics; Microprocessors; Process design; Production; Silicon; Transistors; Wiring;
Conference_Titel :
Electronic Components and Technology Conference, 1996. Proceedings., 46th
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3286-5
DOI :
10.1109/ECTC.1996.550503
