Moisture sensitivity evaluation of ball grid array packages

Author

Yip, Laurene ; Massingill, Tom ; Naini, Helen

Author_Institution

VLSI Technol. Inc., San Jose, CA, USA

fYear

1996

fDate

28-31 May 1996

Firstpage

829

Lastpage

835

Abstract

Ball Grid Array (BGA) packages have been gaining popularity due to the increasing demand for greater interconnect density. For high I/O applications, plastic BGA (PBGA) and tape BGA (TBGA) are attractive alternatives to fine-pitch quad flat pack and pin grid array packages because of their relative low cost, ease of surface mount assembly, and smaller board space requirement. However, since PBGA and TBGA are non-hermetic packages, they are vulnerable to moisture-induced damage during the surface mount assembly process. An evaluation was performed to investigate the impact of moisture on package delamination and cracking during the solder reflow process and the reliability of PBGA and TBGA packages. Based on our study using scanning acoustic microscopy and reliability stress tests, both PBGA and TBGA can be safely surface mounted if proper storage and handling guidelines are followed

Keywords

acoustic microscopy; cracks; delamination; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; moisture; plastic packaging; reflow soldering; surface mount technology; ball grid array packages; board space requirement; cracking; high I/O applications; interconnect density; moisture sensitivity evaluation; moisture-induced damage; nonhermetic packages; package delamination; plastic BGA; reliability; reliability stress tests; scanning acoustic microscopy; solder reflow process; surface mount assembly; tape BGA; Assembly; Costs; Delamination; Electronics packaging; Microscopy; Moisture; Performance evaluation; Plastic packaging; Stress; Surface cracks;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1996. Proceedings., 46th

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-3286-5

Type

conf

DOI

10.1109/ECTC.1996.550504

Filename

550504